Wai San Loke

香港

Wai San Loke is Managing Director of Baring Private Equity. Mr. Loke has been responsible for and involved in a number of the Firm’s investments. Mr. Loke serves on the boards of directors of several portfolio companies and has been active in assisting management teams structure acquisitions and Asian joint ventures. He currently serves as the non-executive Chairman of Resilience and is active on several compensation and audit committees. Prior to Baring Private Equity, Mr. Loke was a Vice President with the private equity firm H&Q Asia Pacific where he was responsible for deal origination, execution and monitoring of investments in Asia and the U.S. Prior to joining H&Q Asia Pacific, Mr. Loke was a senior consultant with AT Kearney where he led client engagements across Asia, Australia and the U.S. Before that he spent two years in R&D with Motorola’s Cellular Infrastructure Group. Mr. Loke is the President of the Singapore American Business Association based in San Francisco. He was born in Singapore and holds an MBA from the University of Chicago in Finance & Strategy and a Bachelor of Science in Electrical Engineering from Lehigh University.